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修改led为gpio
hc
2024-10-12
a5969cabbb4660eab42b6ef0412cbbd1200cf14d
[~hc/RK356X_SDK_RELEASE.git]
/
buildroot
/
package
/
rockchip
/
ros
/
bond-core
/
test-bond
/
test-bond.mk
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TEST_BOND_SUBDIR = test_bond
TEST_BOND_DEPENDENCIES = cmake_modules bondcpp message-generation rostest
$(eval $(catkin-packages-set))
